2024/5/27 16:51:33
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1 Features
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22−
– 2000-V Human-Body Model (A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Available in the Texas Instruments NanoStar™ Package
• Low Static-Power Consumption (ICC = 0.9 µA Maximum)
• Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typical)
• Low Noise
– Overshoot and Undershoot <10% of VCC
• Input-Disable Feature Allows Floating Input Conditions
• Ioff Supports Partial-Power-Down Mode Operation
• Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 4.6 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
2 Applications
• Audio Dock: Portable
• BluRay™ Players and Home Theaters
• Personal Digital Assistant (PDA)
• Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital
• Solid-State Drive (SSD): Client and Enterprise
• TV: LCD/Digital and High-Definition (HDTV)
• Tablet: Enterprise
• Wireless Headsets, Keyboards, and Mice
3 Description
The AUP family is TI s premier solution to the industry s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The LowestPower Family and Excellent Signal Integrity ).
This bus buffer gate is a single line driver with a 3- state output. The output is disabled when the outputenable (OE) input is low. This device has the inputdisable feature, which allows floating input signals.
To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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