SN74AUP1G126YZPR

具有三态输出的单路 0.8V 至 3.6V 低功耗缓冲器

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1 Features

• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

• ESD Performance Tested Per JESD 22−

– 2000-V Human-Body Model (A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Available in the Texas Instruments NanoStar™ Package

• Low Static-Power Consumption (ICC = 0.9 µA Maximum)

• Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise – Overshoot and Undershoot <10% of VCC

• Input-Disable Feature Allows Floating Input Conditions

• Ioff Supports Partial-Power-Down Mode Operation

• Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation

• tpd = 4.6 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

2 Applications

• Audio Dock: Portable

• BluRay™ Players and Home Theaters

• Personal Digital Assistant (PDA)

• Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital

• Solid-State Drive (SSD): Client and Enterprise

• TV: LCD/Digital and High-Definition (HDTV)

• Tablet: Enterprise

• Wireless Headsets, Keyboards, and Mice

3 Description

The AUP family is TI s premier solution to the industry s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity.

This bus buffer gate is a single line driver with a 3- state output. The output is disabled when the outputenable (OE) input is low. This device has the inputdisable feature, which allows floating input signals.

To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.