2024/6/24 18:32:05
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1 Features
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model (A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Available in the Texas Instruments NanoStar™ Package
• Low Static-Power Consumption (ICC = 0.9 µA Maximum)
• Low Dynamic-Power Consumption (Cpd = 4.4 pF Typical at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typical)
• Low Noise – Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Includes Schmitt-Trigger Inputs
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 5.1 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
2 Applications
• Grid Infrastructure
• PC & Notebooks
• Tablets
• Factory Automation & Control
• Gaming
• Server
3 Description
The AUP family of devices is TI s premier solution to the industry s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
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